MP3V5100 rev 0, 4/2009 freescale semiconductor ? freescale semiconductor, in c., 2009. all rights reserved. pressure integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and calibrated the MP3V5100 series piezoresistive transducers are state-of-the-art monolithic silicon pressure sensors des igned for a wide range of applications, but particularly those employing a micr ocontroller or microprocessor with a/d inputs. this transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is pr oportional to the applied pressure. features ? 2.5% maximum error over 0 to 85 c ? ideally suited for mi croprocessor or microcontroller-based systems ? thermoplastic (pps) surface mount package ? patented silicon shear stress strain gauge ? available in differential and gauge configurations ordering information device name package options case no. # of ports pressure type device marking none single dual gauge differential absolute small outline package (MP3V5100 series) MP3V5100gc6u rails 482a ? ? MP3V5100g MP3V5100gc6t1 tape & reel 482a ? ? MP3V5100g MP3V5100gp trays 1369 ? ? MP3V5100gp MP3V5100 series 0 to 100 kpa (0 to 14.5 psi) 0.1 to 3.1 v output small outline package MP3V5100gc6u/c6t1 case 482a-01 MP3V5100gp case 1369-01 application examples ? process control ? patient monitoring ? pump/motor control ? pressure switching
MP3V5100 sensors 2 freescale semiconductor pressure operating characteristics table 1. operating characteristics ( v s = 3.0 vdc, t a = 25c unless otherwise noted, p1 > p2. decoupling circuit shown in figure 3 required to meet specification.) characteristic symbol min typ max unit pressure range (1) 1. 1.0 kpa (kilopascal) equals 0.145 psi. p op 0 ? 100 kpa supply voltage (2) 2. device is ratiometric within this specified excitation range. v s 2.7 3.0 3.3 vdc supply current i o ? 7.0 10 madc minimum pressure offset (3) (0 to 85 c) @ v s = 3.0 volts 3. offset (v off ) is defined as the output voltage at the minimum rated pressure. v off 0.11 0.18 0.25 vdc full scale output (4) (0 to 85 c) @ v s = 3.0 volts 4. full scale output (v fso ) is defined as the output voltage at the maximum or full rated pressure. v fso 2.81 2.88 2.95 vdc full scale span (5) (0 to 85 c) @ v s = 3.0 volts 5. full scale span (v fss ) is defined as the algebraic difference between the output vo ltage at full rated pressure and the output voltage at the minimum rated pressure. v fss ?2.7?vdc accuracy (6) (0 to 85 c) 6. accuracy (error budget) consists of the following: linearity: output deviation from a stra ight line relationship with pressure over the specified pressure range. temperature hysteresis: output deviation at any temperature within the operating temperature range, after the temperature is cyc led to and from the minimum or maximum operating temperatur e points, with zero differential pressure applied. pressure hysteresis: output devia tion at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25 c. tcspan: output deviation over the temperature range of 0 to 85 c, relative to 25 c. tcoffset: output deviation with minimum rated pres sure applied, over the temperature range of 0 to 85 c, relative to 25 c. variation from nominal: the variation from nominal values , for offset or full scale span, as a percent of v fss , at 25 c. ??? 2.5 %v fss sensitivity v/p ? 27 ? mv/kpa response time (7) 7. response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when s ubjected to a specified step change in pressure. t r ?1.0?ms output source current at full scale output i o+ ?0.1?madc warm-up time (8) 8. warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. ??20?ms offset stability (9) 9. offset stability is the product's output deviation when subjected to 1000 hours of pu lsed pressure, temperature cycling with bias test. ?? 0.5 ? %v fss
MP3V5100 sensors freescale semiconductor 3 pressure maximum ratings figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. figure 1. integrated pressure sensor schematic table 2. maximum ratings (1) 1. exposure beyond the specified limits may c ause permanent damage or degradation to the device. rating symbol value unit maximum pressure (p1 > p2) p max 400 kpa storage temperature t stg ?40 to +125 c operating temperature t a ?40 to +125 c sensing element thin film temperature compensation and gain stage #1 gain stage #2 and ground reference shift circuitry v s v out gnd pins 1, 5, 6, 7, and 8 are no connects for small outline package device 2 4 3
MP3V5100 sensors 4 freescale semiconductor pressure on-chip temperature compensation, ca libration and sign al conditioning the performance over tem perature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. figure 2 illustrates the differential or gauge configuration in the basic chip carrier (case 482). a fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. the MP3V5100 series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. media, other than dry air, may have adverse effects on sensor performance and long-term reliability. contact the factory for information regarding media compatibility in your application. figure 3 shows the recommended decoupling circuit for interfacing the integrated se nsor to the a/d input of a microprocessor or microcontroller. proper decoupling of the power supply is recommended. figure 4 shows the sensor output signal relative to pressure input. typical, minimum, and maximum output curves are shown for operation over a temperat ure range of 0 to 85 c using the decoupling circuit shown in figure 3 . the output will saturate outside of the specified pressure range. figure 2. cross-sectional diagram sop (not to scale) figure 3. recommended power supply decoupling and output filtering (for additional output filtering, please refer to application note an1646.) fluoro silicone gel die coat wire bond die p1 stainless steel cap thermoplastic case die bond differential sensing element p2 lead frame +3 v 1.0 f 0.01 f 470 pf gnd v s v out ips output
MP3V5100 sensors freescale semiconductor 5 pressure figure 4. output versus pressure differential differential pressure (kpa) output (v) 3 2 1 0 100 typical min max 0 transfer function: v out = v s *(0.009 * p+0.06) (pressure e rror *temp. factor * 0.009 * v s ) v s = 3.0 vdc temp = 0 to 85c pe = 2.5 tm = 1 nominal transfer value: v out = v s x (0.009 x p + 0.06) (pressure error x temp. factor x 0.009 x v s ) v s = 3.0 v 0.30 vdc transfer function MP3V5100 series temp multiplier ?40 3 0 to 85 1 +125 3 temperature in c 4.0 3.0 2.0 0.0 1.0 ?40 ?20 0 20 40 60 140 120 100 80 temperature error factor note: the temperature multiplier is a linear response from 0 to ?40c and from 85 to 125c. temperature error band
MP3V5100 sensors 6 freescale semiconductor pressure pressure (p1)/vacuum (p2) side identification table freescale designates the two si des of the pressure sensor as the pressure (p1) side and the vacuum (p2) side. the pressure (p1) side is the side containing fluoro silicone gel which protects the die from harsh media. the pressure sensor is designed to operat e with positive differential pressure applied, p1 > p2. the pressure (p1) side may be identified by using the following table: minimum recommended footprint fo r surface mounted applications surface mount board la yout is a critical portion of the total design. the footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. with the correct footprint, the packages will se lf align when subjected to a solder reflow process. it is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. figure 5. small outline package footprint pressure error band pressure error (max) 0 to 100 kpa 2.5 kpa pressure (kpa) 2 ?3 0 100 0 3 1 ?2 ?1 pressure error (kpa) part number case type pressure (p1) side identifier MP3V5100gc6u/c6t1 482a side with port attached MP3V5100gp 1369 side with port attached 0.660 16.76 0.060 typ 8x 1.52 0.100 typ 8x 2.54 0.100 typ 8x 2.54 0.300 7.62 inch mm scale 2:1
MP3V5100 sensors freescale semiconductor 7 pressure package dimensions case 482a-01 issue a small outline package pin 1 identifier h seating plane -t- w c m j k v dim min max min max millimeters inches a 10.54 0.425 0.415 10.79 b 10.54 0.425 0.415 10.79 c 12.70 0.520 0.500 13.21 d 0.96 0.042 0.038 1.07 g 0.100 bsc 2.54 bsc h 0.002 0.010 0.05 0.25 j 0.009 0.011 0.23 0.28 k 0.061 0.071 1.55 1.80 m 0? 7? 0? 7? n 0.444 0.448 11.28 11.38 s 0.709 0.725 18.01 18.41 v 0.245 0.255 6.22 6.48 w 0.115 0.125 2.92 3.17 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006). 5. all vertical surfaces 5? typical draft. s d 8 pl g 4 5 8 1 s b m 0.25 (0.010) a t -a- -b- n s
MP3V5100 sensors 8 freescale semiconductor pressure package dimensions case 1369-01 issue o small outline package notes: 1. 2. 3. 4. controlling dimension: inch. interpret dimensions and tolerances per asme y14.5m, 1994. dimensions "d" and "e1" do not include mold flash or protrusions. mold flash or protrusions shall not exceed 0.006 (0.152) per side. dimension "b" does not include dambar protrusion. allowable dambar protrusion shall be 0.008 (0.203) maximum. n a c 0.004 (0.1) detail g seating plane 8x p t ? d e e/2 e a m 0.004 (0.1) b c e1 a b a 0.008 (0.20) b c 8x b 2 places 4 tips 1 4 8 5 f dim min max min max millimeters inches a 0.300 0.330 7.11 7.62 a1 0.002 0.010 0.05 0.25 b 0.038 0.042 0.96 1.07 d 0.465 0.485 11.81 12.32 e e1 0.465 0.485 11.81 12.32 e m 0.270 0.290 6.86 7.36 n 0.080 0.090 2.03 2.28 p 0.009 0.011 0.23 0.28 t 0.115 0.125 2.92 3.17 0.100 bsc 2.54 bsc f 0.245 0.255 6.22 6.47 k 0.120 0.130 3.05 3.30 l 0.061 0.071 1.55 1.80 0? 7? 0? 7? 0.717 bsc 18.21 bsc k m gage plane detail g l a1 .014 (0.35)
MP3V5100 rev. 0 4/2008 how to reach us: home page: www.freescale.com web support: http://www.freescale.com/support usa/europe or locations not listed: freescale semiconductor, inc. technical information center, el516 2100 east elliot road tempe, arizona 85284 1-800-521-6274 or +1-480-768-2130 www.freescale.com/support europe, middle east, and africa: freescale halbleiter deutschland gmbh technical information center schatzbogen 7 81829 muenchen, germany +44 1296 380 456 (english) +46 8 52200080 (english) +49 89 92103 559 (german) +33 1 69 35 48 48 (french) www.freescale.com/support japan: freescale semiconductor japan ltd. headquarters arco tower 15f 1-8-1, shimo-meguro, meguro-ku, tokyo 153-0064 japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com asia/pacific: freescale semiconductor china ltd. exchange building 23f no. 118 jianguo road chaoyang district beijing 100022 china +86 010 5879 8000 support.asia@freescale.com for literature requests only: freescale semiconductor lite rature distribution center 1-800-441-2447 or +1-303-675-2140 fax: +1-303-675-2150 ldcforfreescalesemiconductor@hibbertgroup.com information in this document is provided solely to enable system and software implementers to use freescale semiconduc tor products. there are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. freescale semiconductor reserves the right to make changes without further notice to any products herein. freescale semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does freescale semiconductor assume any liability ar ising out of the application or use of any product or circuit, and specifically discl aims any and all liability, including without limitation consequential or incidental damages. ?typical? parameters that may be provided in freescale semiconductor data s heets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typicals?, must be validated for each customer application by customer?s technical experts. freescale se miconductor does not convey any license under its patent rights nor the rights of others. freescale semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the fa ilure of the freescale semiconductor product could create a situation where personal injury or death may occur. should buyer purchase or use freescale semiconductor products for any such unintended or unauthorized application, buyer shall indemni fy and hold freescale semiconductor and its officers, employees, subsidiaries, affili ates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that freescale semiconductor was negligent regarding the design or manufacture of the part. freescale? and the freescale logo are trademarks of freescale semiconductor, inc. all other product or service names are the property of their respective owners. ? freescale semiconductor, inc. 2009. all rights reserved.
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